Printed circuit boards form a major part in almost all electronic gadgets and devices. Manufacturers can be provided with drawn designs by amateur electricians and use them in manufacturing of PCB, as it is not such a difficult process after all. Multi layer, single side and double side boards are the three categories of these boards. Materials made of nickel, aluminum or copper are the ones that are used in conducting them. Density and complexity of the circuits are the determinant factors when selecting the conduction material. Here are the stages that are involved in the making of the boards.
A conductive material is used to plate the backing. Conduction between the layers is enhanced by drilling holes into the backing. To remove any small conductor particles that may be present, the board is scrubbed. Filtration process is applied to recycle the recovered particles. This is because, if not recycled, the copper may form a mixture with the other wastes and then become quite hazardous to the environment.
The board is then cleaned. Etching also takes place to allow for proper adhesion in the next stage. Once this has been carried out, there is an addition of another layer of conductor. The process of electrolysis copper plating is applied in order to conduct the holes that had been drilled previously. Both alkaline based and acidic based solutions such as copper sulfate can be used to enhance pH balance.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
A roller, squeegee, spray or silk screen can be used to apply the liquid resist. The liquid can be applied on either or both sides or just on a specific area on the surface. Light can be used in order to get better circuits.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
A conductive material is used to plate the backing. Conduction between the layers is enhanced by drilling holes into the backing. To remove any small conductor particles that may be present, the board is scrubbed. Filtration process is applied to recycle the recovered particles. This is because, if not recycled, the copper may form a mixture with the other wastes and then become quite hazardous to the environment.
The board is then cleaned. Etching also takes place to allow for proper adhesion in the next stage. Once this has been carried out, there is an addition of another layer of conductor. The process of electrolysis copper plating is applied in order to conduct the holes that had been drilled previously. Both alkaline based and acidic based solutions such as copper sulfate can be used to enhance pH balance.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
A roller, squeegee, spray or silk screen can be used to apply the liquid resist. The liquid can be applied on either or both sides or just on a specific area on the surface. Light can be used in order to get better circuits.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
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